| 1971 |
|
Company established, representative: Katsuhisa Shindo |
| 1972 |
|
Production of printed circuits, HIC begins |
| 1973 |
|
Development of TAB tapes begins |
| 1974 |
|
TAB tapes for digital watches are mass produced |
| 1975 |
|
TAB tapes for an ultra-thin 7 mm electronic calculator are mass produced |
| 1976 |
|
Double-sided TAB tapes are developed for digital watches |
| 1977 |
|
Representative Katsuhisa Shindo receives the Fifth Class Order of the Sacred Treasure / TAB tapes for large computers are produced |
| 1978 |
|
Partially plated TAB tapes are produced, development of precision FPC begins |
| 1979 |
|
Hiroaki Shindo assumes the position of Representative |
| 1980 |
|
Mass production of a TAB tape with 100 μm pitch pattern begins |
| 1981 |
|
TAB tapes are used in fax heads |
| 1982 |
|
Research on TAB tapes for IC cards begins |
| 1983 |
|
TAB tapes are used in credit card-sized calculators |
| 1984 |
|
Our plants are made cleaner, 300-pin TAB tapes are released |
| 1985 |
|
Licence received for transfer bump TAB / 70 mm-width TAB tape is developed |
| 1987 |
|
Exporting to Europe begins |
| 1988 |
|
600-pin TAB tape is developed / Exporting to the United States begins / Kansai Sales Office is established |
| 1989 |
|
TAB tape with 60 μm pitch is developed |
| 1991 |
|
Construction of Shonan No. 3 Plant is completed |
| 1992 |
|
Hisako Shindo assumes the role of Representative / Mass production of FLEX-TAB tapes begins |
| 1993 |
|
Double-sided FLEX-TAB tape developed |
| 1996 |
|
Mass production of tapes for T-BGA, CSP begins |
| 1997 |
|
TAB tape with 40 μm pitch is developed / Construction of Ibraki Naka Plant completed |
| 1998 |
|
Shonan Plant acquired ISO9001 certification |
| 1999 |
|
Mass production of COF begins / TZ-CSP developed / Tokyo Headquarters relocated to Chiyoda Ward |
| 2000 |
|
Construction of Shonan No. 4 Plant completed / Naka Plant acquired ISO 9001 certification / N-TAB is mass produced |
| 2001 |
|
Adjacent land to Shonan Plant acquired / Relocated Facilities (to A building) and Packaging (to B building) |
| 2002 |
|
35 μm pitch is developed and mass produced / Development of 30 μm pitch begins |
| 2003 |
|
Acquired ISO 14001 certification / Mass production of 30 μm pitch begins |
| 2004 |
|
Naka No. 2 plant / Ryogoku Headquarters building renewed / Tokyo Headquarters relocated to Awaji-cho |
| 2005 |
|
Construction of No. 5 Plant completed / Packaging operations are expanded / Development of 27.5 μm pitch begins |
| 2006 |
|
Construction of Shanghai Plant completed / Packaging operations are expanded / Mass production of 27.5 μm pitch begins / Development of COF with 20 μm pitch begins |
| 2007 |
|
Tokyo Headquarters relocated to Ryogoku |
| 2012 |
|
Noriyuki Tanaka assumes the role of Representative |
| 2013 |
|
Acquisition of Packaging Materials Business Unit of Hitachi Densen Co., Ltd. is executed and completed |
| 2015 |
|
Company name changes to FLEXCEED Co.,Ltd. |
| 2016 |
|
Kenichi Horie assumes the role of Representative |
| 2017 |
|
Taiwan branch established |
| 2018 |
|
Li Xiaohua assumes a Representative Director, Chairperson, President and CEO |
