1971 |
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Company established, representative: Katsuhisa Shindo |
1972 |
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Production of printed circuits, HIC begins |
1973 |
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Development of TAB tapes begins |
1974 |
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TAB tapes for digital watches are mass produced |
1975 |
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TAB tapes for an ultra-thin 7 mm electronic calculator are mass produced |
1976 |
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Double-sided TAB tapes are developed for digital watches |
1977 |
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Representative Katsuhisa Shindo receives the Fifth Class Order of the Sacred Treasure / TAB tapes for large computers are produced |
1978 |
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Partially plated TAB tapes are produced, development of precision FPC begins |
1979 |
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Hiroaki Shindo assumes the position of Representative |
1980 |
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Mass production of a TAB tape with 100 μm pitch pattern begins |
1981 |
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TAB tapes are used in fax heads |
1982 |
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Research on TAB tapes for IC cards begins |
1983 |
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TAB tapes are used in credit card-sized calculators |
1984 |
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Our plants are made cleaner, 300-pin TAB tapes are released |
1985 |
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Licence received for transfer bump TAB / 70 mm-width TAB tape is developed |
1987 |
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Exporting to Europe begins |
1988 |
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600-pin TAB tape is developed / Exporting to the United States begins / Kansai Sales Office is established |
1989 |
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TAB tape with 60 μm pitch is developed |
1991 |
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Construction of Shonan No. 3 Plant is completed |
1992 |
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Hisako Shindo assumes the role of Representative / Mass production of FLEX-TAB tapes begins |
1993 |
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Double-sided FLEX-TAB tape developed |
1996 |
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Mass production of tapes for T-BGA, CSP begins |
1997 |
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TAB tape with 40 μm pitch is developed / Construction of Ibraki Naka Plant completed |
1998 |
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Shonan Plant acquired ISO9001 certification |
1999 |
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Mass production of COF begins / TZ-CSP developed / Tokyo Headquarters relocated to Chiyoda Ward |
2000 |
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Construction of Shonan No. 4 Plant completed / Naka Plant acquired ISO 9001 certification / N-TAB is mass produced |
2001 |
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Adjacent land to Shonan Plant acquired / Relocated Facilities (to A building) and Packaging (to B building) |
2002 |
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35 μm pitch is developed and mass produced / Development of 30 μm pitch begins |
2003 |
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Acquired ISO 14001 certification / Mass production of 30 μm pitch begins |
2004 |
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Naka No. 2 plant / Ryogoku Headquarters building renewed / Tokyo Headquarters relocated to Awaji-cho |
2005 |
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Construction of No. 5 Plant completed / Packaging operations are expanded / Development of 27.5 μm pitch begins |
2006 |
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Construction of Shanghai Plant completed / Packaging operations are expanded / Mass production of 27.5 μm pitch begins / Development of COF with 20 μm pitch begins |
2007 |
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Tokyo Headquarters relocated to Ryogoku |
2012 |
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Noriyuki Tanaka assumes the role of Representative |
2013 |
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Acquisition of Packaging Materials Business Unit of Hitachi Densen Co., Ltd. is executed and completed |
2015 |
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Company name changes to FLEXCEED Co.,Ltd. |
2016 |
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Kenichi Horie assumes the role of Representative |
2017 |
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Taiwan branch established |
2018 |
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Li Xiaohua assumes a Representative Director, Chairperson, President and CEO |