History

History

1971   Company established, representative: Katsuhisa Shindo
1972   Production of printed circuits, HIC begins
1973   Development of TAB tapes begins
1974   TAB tapes for digital watches are mass produced
1975   TAB tapes for an ultra-thin 7 mm electronic calculator are mass produced
1976   Double-sided TAB tapes are developed for digital watches
1977   Representative Katsuhisa Shindo receives the Fifth Class Order of the Sacred Treasure / TAB tapes for large computers are produced
1978   Partially plated TAB tapes are produced, development of precision FPC begins
1979   Hiroaki Shindo assumes the position of Representative
1980   Mass production of a TAB tape with 100 μm pitch pattern begins
1981   TAB tapes are used in fax heads
1982   Research on TAB tapes for IC cards begins
1983   TAB tapes are used in credit card-sized calculators
1984   Our plants are made cleaner, 300-pin TAB tapes are released
1985   Licence received for transfer bump TAB / 70 mm-width TAB tape is developed
1987   Exporting to Europe begins
1988   600-pin TAB tape is developed / Exporting to the United States begins / Kansai Sales Office is established
1989   TAB tape with 60 μm pitch is developed
1991   Construction of Shonan No. 3 Plant is completed
1992   Hisako Shindo assumes the role of Representative / Mass production of FLEX-TAB tapes begins
1993   Double-sided FLEX-TAB tape developed
1996   Mass production of tapes for T-BGA, CSP begins
1997   TAB tape with 40 μm pitch is developed / Construction of Ibraki Naka Plant completed
1998   Shonan Plant acquired ISO9001 certification
1999   Mass production of COF begins / TZ-CSP developed / Tokyo Headquarters relocated to Chiyoda Ward
2000   Construction of Shonan No. 4 Plant completed / Naka Plant acquired ISO 9001 certification / N-TAB is mass produced
2001   Adjacent land to Shonan Plant acquired / Relocated Facilities (to A building) and Packaging (to B building)
2002   35 μm pitch is developed and mass produced / Development of 30 μm pitch begins
2003   Acquired ISO 14001 certification / Mass production of 30 μm pitch begins
2004   Naka No. 2 plant / Ryogoku Headquarters building renewed / Tokyo Headquarters relocated to Awaji-cho
2005   Construction of No. 5 Plant completed / Packaging operations are expanded / Development of 27.5 μm pitch begins
2006   Construction of Shanghai Plant completed / Packaging operations are expanded / Mass production of 27.5 μm pitch begins / Development of COF with 20 μm pitch begins
2007   Tokyo Headquarters relocated to Ryogoku
2012   Noriyuki Tanaka assumes the role of Representative
2013   Acquisition of Packaging Materials Business Unit of Hitachi Densen Co., Ltd. is executed and completed
2015   Company name changes to FLEXCEED
2016   Kenichi Horie assumes a Representative Director, President and CEO.