Supporting Device (Hearing Aid)
Miniaturization and high reliability is required for supporting devices such as hearing aids. μBGA or other small form factor BGA can meet the demand.
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- Feature of μBGA Package
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- High Speed Structure
(1) Shorter Routing by Ribbon Lead than Wire Bonding
(2) Low Cost / Ultra Small Outline / Very Light - Highly Dense Package
(3) Highly Dense Circuit by TAB-Base Circuit - High Reliability
(4) High Board-Level Reliability of Temperature Cycle by Elastomer
< Thermal Cycle Test ; On Board T/C Test >
- CSP for Wearable Products
μBGA is a Chip Scale Package (CSP). CSP can realize ultra small outline and very light devices which is required for wearable products. FLEXCEED is a total manufacture of μBGA package which can design / produce TAB for it and assemble the package with customers' dies.
* μBGA : Trade Mark of Tessera, Inc.
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