T-BGA

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T-BGA

Semiconductor packages for high speed devices brings over-heating issues. In the case BGA package in face-down structure with heatspreader on the back of the package.

For these packages, ceramics substrate or organic substrate with multilayer are sometimes used, but TAB substrate may be an alternative. TAB (1 Metal or 2 Metal ) provides short distance routing by fine pitch technologies, giving lower inductance for the package.

Moreover the material of TAB is polyimide with lower dielectric constant, providing low loss transmission.