BGA (Ball Grid Array) Substrate with Copper Plugged Plating

BGA (Ball Grid Array) Substrate with Copper Plugged Plating

Challenge for BGA package substrate used in mobile devices is to prevent solder joints from breaking in drop test for mobile.
FLEXCEED solved this issue by the application of copper plating in the vias for solder balls to enhance the resistance to the drop impact.

BGA (Ball Grid Array) Substrate with Copper Plugged Plating