CSP(Chip Scale Package)

Mobile

CSP(Chip Scale Package)

CSP is package whose size is equal to or similar to size of a assembled chip. There are some bonding method for CSP, such as wire bonding or flip chip bonding, and FLEXCEED can supply substrates for both types.
FLEXCEED can realize miniaturizing and low price by Reel-to-Reel process and high unit density with fine pitch technologies.

  • CSP(Chip Scale Package)