Supporting Device (Hearing Aid)

Supporting Device (Hearing Aid)

Miniaturization and high reliability is required for supporting devices such as hearing aids. μBGA or other small form factor BGA can meet the demand.

  • Feature of μBGA Package
    Feature of μBGA Package
    High Speed Structure
    (1) Shorter Routing by Ribbon Lead than Wire Bonding
    (2) Low Cost / Ultra Small Outline / Very Light
    Highly Dense Package
    (3) Highly Dense Circuit by TAB-Base Circuit
    High Reliability
    (4) High Board-Level Reliability of Temperature Cycle by Elastomer
    < Thermal Cycle Test ; On Board T/C Test >
    Shorter Routing by Ribbon Lead
    CSP for Wearable Products
    μBGA is a Chip Scale Package (CSP). CSP can realize ultra small outline and very light devices which is required for wearable products. FLEXCEED is a total manufacture of μBGA package which can design / produce TAB for it and assemble the package with customers' dies.
    * μBGA : Trade Mark of Tessera, Inc.